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Lineng Tech’s Participation in SC High Performance 2025 in Hamburg, Germany
Release time:
2025-06-13
SC High Performance 2025, a world-renowned exhibition focusing on high-performance computing (HPC), artificial intelligence (AI), and related cutting-edge technologies, was successfully held in Hamburg, Germany, from June 10th to 12th, 2025. As a professional enterprise dedicated to advanced thermal management solutions, Lineng Tech actively participated in this grand event, setting up its booth at Hall H, Booth C54, and showcasing its core products and technological strengths to global industry peers and visitors.
During the three-day exhibition, Lineng Tech brought four key product lines, all of which were closely aligned with the exhibition’s focus on HPC and AI technological development. The first core product on display was the AI computing power cooling solution, which was specifically designed to address the severe heat generation challenge of high-density AI chips and large language model (LLM) workloads. Compared with traditional air-cooling methods, this solution featured higher heat transfer efficiency, effectively reducing energy consumption while ensuring that AI processors operated at optimal temperatures, thus maintaining peak performance and extending equipment lifespan.
The second major product was the data center cooling solution, a comprehensive thermal management system tailored for modern data centers. With the rapid growth of AI and cloud computing, data centers’ energy consumption and heat generation have surged, making efficient cooling a critical bottleneck. Lineng Tech’s data center cooling solution effectively reduced the energy consumption of cooling systems—accounting for 30% to 50% of a data center’s total energy use—and helped optimize key efficiency indicators such as PUE (Power Usage Effectiveness), providing a sustainable and cost-effective thermal management option for data center operators.
In addition, Lineng Tech exhibited its UQD (Universal Quick Disconnect) products, which played an important supporting role in liquid cooling systems. These UQD components, designed in line with industry specifications, enabled quick and secure connections and disconnections in cooling circuits, enhancing the maintainability and modularity of liquid cooling systems, which are increasingly essential for high-density HPC and AI infrastructure.
The fourth product line was the high-performance computer (HPC) cooling solution, developed to meet the extreme thermal management needs of supercomputers and high-density computing clusters. This solution leveraged advanced liquid cooling technologies, including direct-to-chip and immersion cooling concepts, to support rack densities of up to hundreds of kilowatts, breaking through the thermal limits of traditional air-cooling methods and providing reliable temperature control for HPC systems operating under heavy workloads.
SC High Performance 2025 attracted over 3,500 attendees, including scientists, researchers, engineers, and industry analysts, as well as more than 160 exhibitors from around the world, making it an ideal platform for technical exchange and business cooperation in the HPC and AI fields. At its booth, Lineng Tech’s professional team communicated in detail with visitors, introduced the technical principles, application scenarios, and core advantages of each product, and listened to the personalized needs and pain points of potential customers and partners. Many visitors showed strong interest in Lineng Tech’s innovative cooling solutions, and in-depth discussions were conducted on future cooperation opportunities and technical customization needs.
Through its participation in this exhibition, Lineng Tech not only showcased its professional strength in the field of advanced thermal management but also gained valuable insights into the latest industry trends, especially the growing demand for efficient, energy-saving, and sustainable cooling solutions driven by the rapid development of AI and HPC. The exhibition also helped Lineng Tech expand its global influence, establish connections with more international industry peers, and lay a solid foundation for its future market expansion in the global high-performance computing and data center fields.
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